JPH0579176B2 - - Google Patents
Info
- Publication number
- JPH0579176B2 JPH0579176B2 JP23288386A JP23288386A JPH0579176B2 JP H0579176 B2 JPH0579176 B2 JP H0579176B2 JP 23288386 A JP23288386 A JP 23288386A JP 23288386 A JP23288386 A JP 23288386A JP H0579176 B2 JPH0579176 B2 JP H0579176B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- wiring board
- printed wiring
- shaped
- solid state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007787 solid Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000011295 pitch Substances 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61232883A JPS6386462A (ja) | 1986-09-29 | 1986-09-29 | ソリツド・ステ−ト・リレ−の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61232883A JPS6386462A (ja) | 1986-09-29 | 1986-09-29 | ソリツド・ステ−ト・リレ−の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6386462A JPS6386462A (ja) | 1988-04-16 |
| JPH0579176B2 true JPH0579176B2 (en]) | 1993-11-01 |
Family
ID=16946333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61232883A Granted JPS6386462A (ja) | 1986-09-29 | 1986-09-29 | ソリツド・ステ−ト・リレ−の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6386462A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2078171B1 (es) * | 1993-12-28 | 1998-01-16 | Smartpack Tecnologia S A | Procedimiento de fabricacion de modulos de potencia con elementos semiconductores. |
| JP7240148B2 (ja) | 2018-11-21 | 2023-03-15 | 株式会社東芝 | 光結合装置 |
-
1986
- 1986-09-29 JP JP61232883A patent/JPS6386462A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6386462A (ja) | 1988-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0579176B2 (en]) | ||
| JPH04148553A (ja) | チップ型電子部品の製造方法 | |
| JPS617692A (ja) | 導体ピンの固着方法および導体ピン固着のプリント配線板 | |
| JPS58178544A (ja) | リ−ドフレ−ム | |
| JPH0278265A (ja) | リードフレームおよびそのリードフレームを使用した複合半導体装置 | |
| JPH0738246A (ja) | はんだ付け方法及び該方法に用いる成形はんだ | |
| JPH087645Y2 (ja) | 面実装用ｉｃパッケージ | |
| JPH0519959Y2 (en]) | ||
| JPS5927061Y2 (ja) | 混成集積回路装置 | |
| JP2004200464A (ja) | 金属配線板 | |
| JP2719459B2 (ja) | 面実装用数字表示器およびその製造方法 | |
| JPS61225827A (ja) | 半導体素子の実装構造 | |
| JPH0513011Y2 (en]) | ||
| JPH0442934Y2 (en]) | ||
| JPH0639479Y2 (ja) | プリント配線板 | |
| JPH0299394A (ja) | メモリーカードモジュール | |
| JP2891254B2 (ja) | 面付実装用電子部品 | |
| JP2599290Y2 (ja) | ハイブリッドｉｃ | |
| JPH0231794Y2 (en]) | ||
| JPS631093A (ja) | 電子部品搭載用基板装置 | |
| JPH0412664Y2 (en]) | ||
| JPS6199359A (ja) | 混成集積回路装置 | |
| JPS62222644A (ja) | テ−プキヤリヤ | |
| JPH0380599A (ja) | 電子回路モジュール | |
| JPS61124158A (ja) | 複合電子部品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |